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    8layers of phone board

    • Material: FR-4 TG170
    • Thickness: 1.2mm
      • TEL：+86 0755-21006156

    PRODUCTS

    Material: FR-4 TG170
    Thickness: 1.2mm
    Dimension: 127*212mm (5*8.4inch)
    Copper: 1oz (35um)
    Surface treatment: ENIG
    Soldermask/Silkscreen: Green/White
    Min. trace width/space: 0.13mm/0.18mm
    Min. hole dia: 0.20mm
    Impedance: single +/-10%

    IMG

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